Kawasaki, Japan

Hidetoshi Shimoda

This inventor holds 1 USPTO granted patent. Top assignee: Mitsubishi Rayon Company, Limited. Active years: 1993.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hidetoshi Shimoda. Retrieved from https://idiyas.com/inventor/hidetoshi-shimoda

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 55(Granted Patents)


Company Filing History:


Years Active: 1993

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1 patent (USPTO):Explore Patents

Title: Hidetoshi Shimoda: Innovator in Printed Wiring Board Technology

Introduction

Hidetoshi Shimoda is a notable inventor based in Kawasaki, Japan. He has made significant contributions to the field of electronics, particularly in the production of printed wiring boards. His innovative approach has led to the development of a patented process that enhances the efficiency and quality of printed wiring board manufacturing.

Latest Patents

Hidetoshi Shimoda holds a patent for a "Process for producing a printed wiring board." This process involves several steps, including preparing a copper-clad laminate with a drilled through-hole, applying a resist pattern, etching, and plating. The method aims to streamline the production of printed wiring boards while ensuring high-quality results.

Career Highlights

Shimoda is associated with Mitsubishi Rayon Company, Limited, where he has applied his expertise in electronics and materials science. His work has been instrumental in advancing the company's capabilities in producing high-performance printed wiring boards.

Collaborations

Throughout his career, Hidetoshi Shimoda has collaborated with esteemed colleagues such as Tadashi Kobayashi and Hiroyuki Uchida. These partnerships have fostered innovation and contributed to the development of cutting-edge technologies in the field.

Conclusion

Hidetoshi Shimoda's contributions to printed wiring board technology exemplify the impact of innovation in the electronics industry. His patented process not only enhances manufacturing efficiency but also sets a standard for quality in the production of printed wiring boards.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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