The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 12, 1993
Filed:
Oct. 28, 1992
Tadashi Kobayashi, Kawasaki, JP;
Hiroyuki Uchida, Kawasaki, JP;
Hidetoshi Shimoda, Kawasaki, JP;
Toshio Takahashi, Kawasaki, JP;
Mitsubishi Rayon Company Ltd., Tokyo, JP;
Abstract
A process for the production of a printed wiring board, which comprises preparing a copper-clad laminate having a through-hole formed by drilling; providing a first resist pattern on the surface of the copper-clad laminate so as to cover a portion to be formed as a conductor pattern; etching the copper-clad laminate; removing the first resist pattern; subjecting the whole laminate to an electroless copper plating; laminating a dry film resist on the copper-clad laminate; exposing and developing the dry film resist to form a second resist pattern in such a manner that the through-hole and a portion to be plated are exposed; subjecting the exposed portions to an electrolytic copper plating; removing the second resist pattern; and removing the exposed electroless copper plating through etching.