Austin, TX, United States of America

Hidetoshi Arimura


 

Average Co-Inventor Count = 5.5

ph-index = 2

Forward Citations = 20(Granted Patents)


Company Filing History:


Years Active: 2013

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2 patents (USPTO):Explore Patents

Title: Hidetoshi Arimura: Innovator in Conductive Inks

Introduction

Hidetoshi Arimura is a notable inventor based in Austin, TX (US). He has made significant contributions to the field of conductive inks, holding 2 patents that showcase his innovative approach to materials science.

Latest Patents

His latest patents include "Additives and modifiers for solvent- and water-based metallic conductive inks." This patent describes a conductive ink that comprises metallic nanoparticles, a polymeric dispersant, and a solvent. The polymeric dispersant can be ionic, non-ionic, or a combination of both. The solvent may consist of water, an organic solvent, or a mixture of both. Additionally, the conductive ink may contain various agents such as a stabilizing agent, adhesion promoter, surface tension modifier, defoaming agent, leveling additive, rheology modifier, and wetting agent. Another patent is for a "Metallic ink," which includes a vehicle, multiple copper nanoparticles, and an alcohol. This conductive metallic ink can be applied to a substrate using methods like inkjet printing and draw-down printing, and it can be pre-cured and cured to create a conductor on the substrate.

Career Highlights

Hidetoshi has worked with several companies, including Applied Nanotech Holdings, Inc. and Ishihara Chemical Co., Ltd. His experience in these organizations has allowed him to refine his expertise in the development of advanced materials.

Collaborations

He has collaborated with notable coworkers such as Xueping Li and Yunjun Li, contributing to various projects in the field of conductive materials.

Conclusion

Hidetoshi Arimura's work in conductive inks represents a significant advancement in materials science. His innovative patents and collaborations highlight his commitment to enhancing the functionality and application of conductive materials.

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