Kanazawa, Japan

Hidetoshi Akashi

USPTO Granted Patents = 6 

Average Co-Inventor Count = 2.1

ph-index = 3

Forward Citations = 13(Granted Patents)


Location History:

  • Kanazawa, JO (2014)
  • Kanazawa, JP (2006 - 2021)

Company Filing History:


Years Active: 2006-2021

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6 patents (USPTO):Explore Patents

Title: Hidetoshi Akashi: Innovator in Workpiece Conveyance Technology

Introduction

Hidetoshi Akashi is a notable inventor based in Kanazawa, Japan. He has made significant contributions to the field of workpiece conveyance devices, holding a total of 6 patents. His innovative designs have enhanced the efficiency and functionality of pressing devices.

Latest Patents

Among his latest patents, Akashi has developed a workpiece conveyance device that is integral to pressing devices. This device features a support member that holds a component capable of detachably securing a workpiece. The design includes a lever unit with both first and second lever portions, which are pivotably linked to facilitate movement. Another notable patent involves a workpiece conveyance device that incorporates a support component, first and second moving members, a driver, and a transmission mechanism. This mechanism allows for coordinated movement between the first and second moving members, enhancing the operational efficiency of the device.

Career Highlights

Hidetoshi Akashi has worked with prominent companies such as Komatsu Industries Corporation and Komatsu Corporation. His experience in these organizations has allowed him to refine his skills and contribute to advancements in industrial technology.

Collaborations

Throughout his career, Akashi has collaborated with talented individuals, including Kenji Nishida and Takashi Moriyasu. These partnerships have fostered innovation and the development of cutting-edge technologies in the field.

Conclusion

Hidetoshi Akashi's contributions to workpiece conveyance technology exemplify his dedication to innovation. His patents reflect a commitment to improving industrial processes and enhancing device functionality.

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