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For the Inventor, By the Inventor

Akishima, Japan

Hideto Sakata

This inventor holds 6 USPTO granted patents. Top assignee: Dai Nippon Printing Co., Ltd.. Active years: 2002-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hideto Sakata. Retrieved from https://idiyas.com/inventor/hideto-sakata

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 6

% Patents Active = 33.3

Average Co-Inventor Count = 2.6

ph-index = 3

Forward Citations = 40(Granted Patents)


Location History:

  • Tokyo, JP (2002 - 2011)
  • Akishima, JP (2011 - 2013)

Company Filing History:

goldMedal6 out of 3,208 
 
Dai Nippon Printing Co., Ltd.
 patents

Years Active: 2002-2013

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6 patents (USPTO):Explore Patents
1. 8456307 - Method for producing sheet with IC tags, apparatus for producing sheet with IC tags, sheet with IC tags, method for fixing IC chips, apparatus for fixing IC chips, and IC tag (2013-06-04),
2. 8169323 - Noncontact IC tag label, airline baggage tag label, and manufacturing method for noncontact IC tag label (2012-05-01),
3. 8162231 - Noncontact IC tag label and method of manufacturing the same (2012-04-24),
4. 8031071 - IC tag label (2011-10-04),
5. 7930822 - Method and device for manufacturing a conductive member for non-contact type data carrier (2011-04-26),
6. 6366358 - Method and apparatus for detecting stripe defects of printed matter (2002-04-02),

Title: Innovations of Hideto Sakata

Introduction

Hideto Sakata is a prominent inventor based in Akishima, Japan. He has made significant contributions to the field of integrated circuit (IC) technology, holding a total of 6 patents. His work primarily focuses on methods and apparatuses for producing sheets with IC tags, which have various applications in modern technology.

Latest Patents

Sakata's latest patents include a range of innovative methods and devices. One notable patent is a method for producing a sheet with IC tags, which involves preparing and feeding a sheet with electrical conductors, applying adhesive, and successively arranging IC chips on the conductors. Another important patent is an apparatus for producing sheets with IC tags, which streamlines the manufacturing process. Additionally, he has developed a noncontact IC tag label that features a band-shaped label base material with an electroconductive layer and an IC chip, enhancing the functionality of tagging systems.

Career Highlights

Hideto Sakata is currently employed at Dai Nippon Printing Co., Ltd., where he continues to innovate in the field of IC technology. His work has not only advanced the production methods of IC tags but has also contributed to the efficiency and effectiveness of various applications in industries such as logistics and retail.

Collaborations

Sakata has collaborated with notable colleagues, including Tetsuji Ogata and Yuki Nakanishi. Their combined expertise has fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Hideto Sakata's contributions to the field of integrated circuit technology are noteworthy and impactful. His innovative patents and collaborative efforts continue to shape the future of IC applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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