Dai Nippon Printing Co., Ltd.

Hideto Sakata

Tetsuji Ogata

Hiroshi Satou

Yuki Nakanishi

Kenta Hayashi

Terunao Tsuchiya

Akihiko Igarashi

Masahiko Soeda

Takaichi Shimomura

Hiroshi Suguro

A method of producing a sheetwith IC tags comprises the steps of: preparing and feeding a sheetwith electrical conductors formed thereon; providing an adhesiveon the sheetwith electrical conductors; preparing multiple IC chipsand successively feeding the IC chips; successively arranging each IC chipon the electrical conductorsof the sheet; and fixing each IC chiponto the electrical conductorsthrough the adhesive. The sheetwith electrical conductors formed thereon includes a non-conductive sheetand a pair of electrical conductors. The pair of electrical conductorsof the sheetwith the electrical conductors are provided on the non-conductive sheet, extend in the feed direction, and are spaced apart from each other.

Method for producing sheet with IC tags, apparatus for producing sheet with IC tags, sheet with IC tags, method for fixing IC chips, apparatus for fixing IC chips, and IC tag

A noncontact IC tag label includes: a band-shaped label base material inclusive of a release surface formed at least at one end of the base material and releasably treated in advance, and a non-release surface; an electroconductive layer formed on the non-release surface of the band-shaped label base material and including a required antenna pattern; and an IC chip mounted on one face of the electroconductive layer. The electroconductive layer and the IC chip are shrouded by a surface protection sheet via a pressure-sensitive adhesive layer. A thermoadhesive resin layer bonded onto the non-release surface of the band-shaped label base material is provided on an opposite face of the electroconductive layer including the antenna pattern, with respect to the surface protection sheet. Also, the pressure-sensitive adhesive layer is bonded onto the non-release surface and release surface of the band-shaped label base material.

Noncontact IC tag label, airline baggage tag label, and manufacturing method for noncontact IC tag label

This invention provides a thin type of noncontact IC tag label that allows materials costs to be reduced without using an antenna-supporting base film. The noncontact IC tag label includes an electroconductive layer of a required antenna pattern shape, an IC chip mounted on one face of the electroconductive layer, and a surface protection sheet supporting the electroconductive layer and the IC chip from a side of the one face of the electroconductive layer via a first pressure-sensitive adhesive layer. An adhesive resin layer having the same shape as the antenna pattern shape of the electroconductive layer is provided on the other face of the electroconductive layer. The adhesive resin layer is temporarily bonded in separable manner onto a release paper formed from paper or a plastic base material.

Noncontact IC tag label and method of manufacturing the same

An IC tag labelA includes an inlet substrate; an antenna patternand an IC chipwhich are provided on one surface of the inlet substrate; and an adhesive layerwhich is mounted on the other surface of the inlet substrate. A release paperis attached to the adhesive layer. An openingwhich serves as a clearance for the IC chipis provided in a portion of the release paperand adhesive layer, the portion corresponding to the IC chip

IC tag label

A conductive member for a non-contact type data carrier such as a wireless tag is simply and cheaply manufactured. A method for manufacturing a conductive member for a non-contact type data carrier comprises: a printing process during which, while a base material () is run, a bonding agent layer () is printed in a predetermined pattern on the surface thereof, and is dried; a bonding process during which a conductive layer () is laminated on the surface of the bonding agent layer () for heating and bonding; a punching process during which the conductive layer () is punched in the above-described pattern on the base material (); and a separating process during which an unnecessary portion () of the conductive layer () is separated from the base material (). Accordingly, a conventional multilayered laminated sheet is not required to realize reduction in the material.

Method and device for manufacturing a conductive member for non-contact type data carrier

A printed matter inspection method and device which detects a defect on the printed matter including a partially inputting camera capable of being moved in a width direction of the printed matter by a mover which inputs a partial image of a pattern on the printed matter and a whole image inputting camera disposed apart from the partially inputting camera by a predetermined distance in the direction the printed matter flows which inputs a whole image including the whole pattern and coordinating, based on a relationship between a position on the whole image, of the partial image and a width-directionwise reference point set on the whole image, the width-directionwise position on the whole image and the width-directionwise position on the mover with each other, when the partially inputting camera is located on an origin set on the mover, positioning and then setting a photographing point, which is to be input by said partially inputting camera, on said whole image, calculating a width-directionwise pixel number between said set photographing point and said width-directionwise reference point on said whole image, multiplying said calculated width-directionwise pixel number by a width-directionwise resolution of said whole image to calculate the width-directionwise moving amount on said moving mechanism; moving said partially inputting camera up to a target position corresponding to said width-directionwise moving amount; and inputting said partial image at an arbitrary timing by said partially inputting camera moved up to said target position.

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Akishima, Japan

Hideto Sakata