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For the Inventor, By the Inventor

Kawasaki, Japan

Hideshi Tokuhira

This inventor holds 9 USPTO granted patents. Top assignee: Fujitsu Corporation. Active years: 2003-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hideshi Tokuhira. Retrieved from https://idiyas.com/inventor/hideshi-tokuhira

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 9

% Patents Active = 22.2

Average Co-Inventor Count = 2.7

ph-index = 4

Forward Citations = 32(Granted Patents)


Location History:

  • Kawasaki, JP (2003 - 2011)
  • Himeji, JP (2008 - 2011)

Company Filing History:

goldMedal9 out of 39,378 
 
Fujitsu Corporation
 patents

Years Active: 2003-2011

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9 patents (USPTO):Explore Patents
1. 7978470 - Electronic apparatus (2011-07-12),
2. 7911795 - Electronic device including electronic component, heat dissipating member and alloy layer (2011-03-22),
3. 7610678 - Heat transfer sheet, heat transfer structural body and manufacturing method of the heat transfer structural body (2009-11-03),
4. 7551435 - Heat-absorbing member, cooling device, and electronic apparatus (2009-06-23),
5. 7502227 - Electronic apparatus (2009-03-10),
6. 7362577 - Electronic component and radiating member, and method of manufacturing semiconductor device using the component and member (2008-04-22),
7. 7155914 - Cooling structure for electronic equipment (2007-01-02),
8. 6790881 - Adhesive composition (2004-09-14),
9. 6576081 - Adhesive, bonding method and assembly of mounting substrate (2003-06-10),

Title: Hideshi Tokuhira: Innovator in Electronic Apparatus

Introduction

Hideshi Tokuhira is a prominent inventor based in Kawasaki, Japan. He has made significant contributions to the field of electronic apparatus, holding a total of 9 patents. His work focuses on innovative designs that enhance the efficiency and functionality of electronic devices.

Latest Patents

One of Tokuhira's latest patents involves an electronic apparatus that features a body flow path in a first housing. This design includes an MPU element that communicates with both an inner and outer flow path formed in heat-dissipating boards. A pump drives a cooling liquid to circulate through these flow paths, ensuring optimal temperature management. Another notable patent is for an electronic device that includes an electronic component, a heat dissipating member, and an alloy layer. This method of manufacturing involves connecting the electronic component and heat dissipating member using a heat conducting member, which is formed through vapor deposition or plating processing.

Career Highlights

Hideshi Tokuhira is currently employed at Fujitsu Corporation, where he continues to innovate and develop new technologies. His work has been instrumental in advancing electronic components and systems, making them more efficient and reliable.

Collaborations

Throughout his career, Tokuhira has collaborated with notable colleagues such as Hiroaki Date and Minoru Ishinabe. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Hideshi Tokuhira's contributions to the field of electronic apparatus demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of technology and its applications, solidifying his reputation as a leading inventor in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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