The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2009
Filed:
Dec. 16, 2004
Hideshi Tokuhira, Kawasaki, JP;
Hiroaki Date, Kawasaki, JP;
Hiroki Uchida, Kawasaki, JP;
Minoru Ishinabe, Kawasaki, JP;
Hideshi Tokuhira, Kawasaki, JP;
Hiroaki Date, Kawasaki, JP;
Hiroki Uchida, Kawasaki, JP;
Minoru Ishinabe, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A pattern is formed with an insulative resin on a bonding face of a silicon chip, which is a heat generating element, and a pattern is formed with the insulative resin on a bonding face of a heat sink, which is a heat dissipating element, in alignment with the insulative resin parts formed on the silicon chip. The silicon chip and the heat sink are bonded to each other via a heat transfer sheet. The silicon chip and the heat sink are bonded to each other by a metal to form metal connection portions in a region where no insulative resin parts are formed, while the silicon ship and the heat sink are bonded to each other by a resin to form resin connection portions in a region where the insulative resin parts are formed.