Location History:
- Atsugi, JP (1986 - 1988)
- Koganei, JP (1985 - 1994)
Company Filing History:
3 out of 5,294 
2 out of 522 
2 out of 17 Years Active: 1985-1994
Title: **Hideo Oikawa: Innovator in Wiring and Semiconductor Technologies**
Introduction
Hideo Oikawa, a distinguished inventor based in Koganei, Japan, has made significant contributions to the fields of wiring and semiconductor technologies. With a total of five patents to his name, Oikawa has demonstrated a remarkable capacity for innovation, addressing complex challenges in electrical engineering.
Latest Patents
Among Hideo Oikawa's latest patents is a novel **Method of connecting wirings through connection hole**. This method involves forming an insulating layer on a first conductive layer and creating a connection hole within the insulating layer. Etching using an ion with a very low etching rate regarding the first conductive layer and a high etching rate concerning the insulating layer results in a taper on the side wall of the connection hole. The process is designed to enhance the effectiveness of connections in electronic components. A typical example of an etching ion used in this method is an oxygen ion.
Another significant patent is the development of a **High-purity metal and metal silicide target for LSI electrodes**. This invention details a high-purity molybdenum target that has an alkali metal content of no more than 100 parts per billion (ppb) and a radioactive element content of no more than 10 ppb. Additionally, the production process of this target involves a wet purification process followed by a series of dry processing methods.
Career Highlights
Hideo Oikawa has worked with reputable organizations throughout his career, including Nippon Telegraph and Telephone Corporation and Nippon Telegraph and Telephone Public Corporation. His contributions to these companies have facilitated advancements in telecommunication technologies and semiconductor manufacturing.
Collaborations
Throughout his innovative journey, Oikawa has collaborated with prominent professionals such as Katsuyuki Machida and Takao Amazawa. These collaborations have not only enriched his work but have also pushed the boundaries of technological advancements in their respective fields.
Conclusion
In summary, Hideo Oikawa's dedication to innovation in wiring and semiconductor technologies has led to numerous valuable patents that enhance functionalities in electronic devices. His partnerships with esteemed organizations and talented colleagues exemplify the collaborative spirit of innovation. Oikawa's work continues to inspire future advancements in the industry.