The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 28, 1986

Filed:

Jul. 26, 1984
Applicant:
Inventors:

Hideo Oikawa, Atsugi, JP;

Takao Amazawa, Atsugi, JP;

Nakahachiro Honma, Musashino, JP;

Hideo Miyazaki, Toda, JP;

Iwao Kyono, Toda, JP;

Nobuyuki Mori, Tokyo, JP;

Yoshiharu Katoh, Toda, JP;

Masami Kuroki, Toda, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22B / ;
U.S. Cl.
CPC ...
75 6 / ; 75 / ; 75 / ; 75 84 ; 419 28 ; 419 29 ; 428641 ; 420429 ;
Abstract

A high-purity high-melting metal target or high-purity high-melting metal silicide target for LSI electrodes having an alkali metal content of not more than 100 ppb and a radioactive element content of not more than 10 ppb is provided by a wet purification process followed by a series of dry processings. Preferably the high-melting metal is molybdenum, tungsten, titanium, niobium or tantalum. More preferably, the high-melting metal is molybdenum.


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