This inventor holds 2 USPTO granted patents. Top assignees: Showa Denko Packaging Co., Ltd., Nippon Shokubai Co., Ltd., Ohtomo Chemical Inc., Corp.. Active years: 2005-2006.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Shiga, JP (2005)
- Tokyo, JP (2006)
Company Filing History:

Years Active: 2005-2006
Title: Hideo Kawai: Innovator in Electronic Packaging and Drilling Technology
Introduction
Hideo Kawai is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the fields of electronic packaging and drilling technology. With a total of 2 patents to his name, Kawai's innovations have had a notable impact on the industry.
Latest Patents
Kawai's latest patents include a packaging material for electronic-part cases and entry boards for use in drilling small holes. The packaging material invention provides a casing material for electronic components that exhibits excellent adhesion with aluminum foil and resin layers. It also boasts impermeability to steam, heat seal properties, and corrosion resistance for electrolytes. The casing material consists of a heat-resistant resin drawn film layer as an outer layer, a thermoplastic resin not-drawn film as an inner layer, and an aluminum foil layer sandwiched between them. Notably, an acrylic polymer layer is included between the aluminum foil layer and the not-drawn film layer.
The entry board invention is designed for drilling small holes in boards. It features a lubricant layer made from a mixture of polyethylene glycol with varying average molecular weights and trimethylolpropane. This lubricant layer is formed over at least one surface of an aluminum base board, with an undercoat layer of a partially saponified product of polyvinyl acetate positioned between the lubricant layer and the base board. The adhesion of the lubricant layer to the base board is exceptional, preventing cracking during use.
Career Highlights
Throughout his career, Hideo Kawai has worked with notable companies such as Showa Denko Packaging Co., Ltd. and Nippon Shokubai Co., Ltd. His experience in these organizations has contributed to his expertise in developing innovative materials and technologies.
Collaborations
Kawai has collaborated with talented individuals in his field, including Katsumi Tanaka and Takahiro Aoyama. These partnerships have fostered a creative environment that has led to the development of groundbreaking inventions.
Conclusion
Hideo Kawai is a distinguished inventor whose work in electronic packaging and drilling technology has made a lasting impact. His innovative patents and collaborations highlight his commitment to advancing technology in these fields.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile