The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2006
Filed:
Oct. 12, 2001
Hideo Kawai, Tokyo, JP;
Katsumi Tanaka, Tokyo, JP;
Takahiro Aoyama, Suita, JP;
Mitsuo Nakazaki, Suita, JP;
Hideo Kawai, Tokyo, JP;
Katsumi Tanaka, Tokyo, JP;
Takahiro Aoyama, Suita, JP;
Mitsuo Nakazaki, Suita, JP;
Showa Denko Packaging Co., Isehara, JP;
Nippon Shokubai Co., Ltd., Osaka, JP;
Abstract
The present invention provides a casing material for an electronic component which has a good adhesion with an aluminum foil and a resin layer, impermeability of steam, heat seal property, and corrosion resistance for an electrolyte. The present invention also provides a casing for an electronic component using the casing material. The present invention also provides an electronic component including the casing. The casing material comprises a heat resistant resin drawn film layer as an outer layer, a thermoplastic resin not-drawn film as an inner layer, and an aluminum foil layer provided between the layers. In particular, an acrylic polymer layer is provided between the aluminum foil layer and the not-drawn film layer.