Mitsuo Nakazaki

Title: Mitsuo Nakazaki: Innovator in Electronic Component Packaging

Introduction

Mitsuo Nakazaki is a notable inventor based in Takatsuki, Japan. He has made significant contributions to the field of electronic component packaging, holding a total of 3 patents. His innovative work focuses on developing materials that enhance the performance and reliability of electronic components.

Latest Patents

One of Nakazaki's latest patents involves a packaging material for electronic-part cases. This invention provides a casing material that exhibits excellent adhesion with aluminum foil and a resin layer, along with steam impermeability, heat seal properties, and corrosion resistance for electrolytes. The casing material consists of a heat-resistant resin drawn film layer as the outer layer, a thermoplastic resin not-drawn film as the inner layer, and an aluminum foil layer sandwiched between them. Notably, an acrylic polymer layer is included between the aluminum foil layer and the not-drawn film layer.

Another significant patent pertains to coating compositions containing crosslinked spherical fine particles. These fine particles are characterized by their toughness, elastic properties, and chemical stability. They are produced through radical polymerization in a suspended state, utilizing a vinyl group-containing compound derived from a selected polyol, an isocyanate group-containing compound, and an active hydrogen-containing vinyl monomer. The secondary products of these fine particles include various derivatives such as coating compositions, adhesive films, and peelable pressure-sensitive adhesive articles.

Career Highlights

Throughout his career, Nakazaki has worked with prominent companies, including Nippon Shokubai Co., Ltd. and Showa Denko Packaging Co., Ltd. His experience in these organizations has contributed to his expertise in developing innovative packaging solutions for electronic components.

Collaborations

Mitsuo Nakazaki has collaborated with notable colleagues such as Takahiro Aoyama and Hideo Kawai. These partnerships have fostered a creative environment that has led to the advancement of technology in the field of electronic packaging.

Conclusion

Mitsuo Nakazaki's contributions to electronic component packaging through his innovative patents and collaborations highlight his role as a significant inventor in this field. His work continues to influence the development of reliable and efficient packaging materials for electronic components.