Ibaraki, Japan

Hideo Chaki

This inventor holds 1 USPTO granted patent. Top assignees: Kabushiki Kaisha Nihon Genma, Matsushita Electric Industrial Co., Ltd.. Active years: 1997.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hideo Chaki. Retrieved from https://idiyas.com/inventor/hideo-chaki

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 1997

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1 patent (USPTO):Explore Patents

Title: Hideo Chaki: Innovator in Solder Technology

Introduction

Hideo Chaki is a notable inventor based in Ibaraki, Japan. He is recognized for his contributions to solder technology, particularly in the development of a tin-lead alloy solder that exhibits high joint strength under conditions likely to induce fatigue fracture. His innovative approach has made a significant impact in the field of electronics.

Latest Patents

Hideo Chaki holds 1 patent for his invention of a solder. The tin-lead alloy solder comprises 15-80 wt. % lead, 0.1-5 wt. % silver, 0.1-10 wt. % antimony, and 0.0005-0.3 wt. % phosphorus, with the balance being tin. This formulation enhances the durability and reliability of solder joints in various applications.

Career Highlights

Throughout his career, Hideo Chaki has worked with prominent companies, including Matsushita Electric Industrial Co., Ltd. and Kabushiki Kaisha Nihon Genma. His experience in these organizations has allowed him to refine his skills and contribute to advancements in solder technology.

Collaborations

Hideo Chaki has collaborated with notable coworkers such as Yasuji Kawashima and Takashi Nagashima. Their combined expertise has fostered innovation and development in their respective fields.

Conclusion

Hideo Chaki's contributions to solder technology exemplify the importance of innovation in engineering. His work continues to influence the industry, ensuring stronger and more reliable electronic connections.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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