The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 1997
Filed:
Nov. 04, 1994
Applicant:
Inventors:
Yasuji Kawashima, Ibaraki, JP;
Takashi Nagashima, Takatsuki, JP;
Akihiko Matsuike, Takarazuka, JP;
Takeshi Meguro, Ibaraki, JP;
Kaoru Shimizu, Osaka, JP;
Hideo Chaki, Ibaraki, JP;
Toshiaki Ogura, Mino, JP;
Assignees:
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Kabushiki Kaisha Nihon Genma, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
420559 ; 420563 ; 420566 ; 420571 ;
Abstract
A tin-lead alloy solder is provided which exhibits high joint strength under conditions which are likely to induce fatigue fracture. The tin-lead alloy solder comprises 15-80 wt. % lead, 0.1-5 wt. % silver, 0.1-10 wt. % antimony, and 0.0005-0.3 phosphorus, the balance being tin.