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For the Inventor, By the Inventor

Anan, Japan

Hideo Asakawa

This inventor holds 12 USPTO granted patents and 4 EPO patents. Top assignee: Nichia Corporation. Active years: 2005-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hideo Asakawa. Retrieved from https://idiyas.com/inventor/hideo-asakawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 12

% Patents Active = 75.0

 

Average Co-Inventor Count = 1.1

ph-index = 8

Forward Citations = 267(Granted Patents)


Company Filing History:

goldMedal12 out of 3,262 
 
Nichia Corporation
 patents

Years Active: 2005-2014

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12 patents (USPTO):Explore Patents
1. 8623255 - Method for making a semiconductor device (2014-01-07),
2. 8525208 - Light emitting device (2013-09-03),
3. 8251530 - Light emitting device (2012-08-28),
4. 7982235 - Light emitting device, package and lead frame (2011-07-19),
5. 7527400 - Light emitting device (2009-05-05),
6. D537047 - Light emitting diode (2007-02-20),
7. D536672 - Light emitting diode (2007-02-13),
8. D517025 - Light emitting diode (2006-03-14),
9. D510912 - Light emitting diode (2005-10-25),
10. 6953952 - Semiconductor device and an optical device using the semiconductor device (2005-10-11),
11. D505397 - Light emitting diode (2005-05-24),
12. D503930 - Light emitting diode (2005-04-12),

Title: Hideo Asakawa: Innovator in Semiconductor Technology

Introduction

Hideo Asakawa is a prominent inventor based in Anan, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 12 patents. His innovative approaches have led to advancements in the manufacturing of semiconductor devices and light-emitting devices.

Latest Patents

Asakawa's latest patents include a method for making a semiconductor device. This method involves creating a semiconductor device that comprises a semiconductor element and a support member with a recess for housing the semiconductor element. The process includes placing at least two lead electrode portions in a molding die, supplying a molding member, heating the molding member to cure it into a package, and removing the package from the molding die. This innovative process ensures a high yield in semiconductor device production.

Another notable patent is for a light-emitting device. This device features a package with an opening that has a side surface and a bottom surface, along with a lead frame exposed to the bottom surface. The lead frame includes a reflection portion bent on the side surface, enhancing the device's efficiency. The design also incorporates a recessed portion on the front surface, a light-emitting element, and a sealing resin, showcasing Asakawa's expertise in optimizing light-emitting technology.

Career Highlights

Hideo Asakawa has dedicated his career to advancing semiconductor technology. His work at Nichia Corporation has positioned him as a key player in the industry. His innovative patents reflect his commitment to improving manufacturing processes and device performance.

Collaborations

Asakawa has collaborated with notable coworkers, including Takeo Kurimoto and Saiki Yamamoto. Their combined expertise has contributed to the successful development of various semiconductor technologies.

Conclusion

Hideo Asakawa's contributions to semiconductor technology through his innovative patents have significantly impacted the industry. His work continues to inspire advancements in device manufacturing and performance.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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