The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2011
Filed:
Feb. 01, 2008
Applicants:
Hideo Asakawa, Anan, JP;
Takeo Kurimoto, Anan, JP;
Inventors:
Hideo Asakawa, Anan, JP;
Takeo Kurimoto, Anan, JP;
Assignee:
Nichia Corporation, Anan-shi, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
The semiconductor device includes a semiconductor element, a lead frame electrically connected to the semiconductor element, and a package having an opening in a front surface with a part of the lead frame protruding from a bottom surface. The protruding lead frame branches into a plurality of end portions, and the end portions are bent to be positioned respectively on a side surface and one of a back surface and a bottom surface of the package.