Location History:
- Nishishirakawa, JP (2000)
- Fukushima, JP (2003 - 2005)
Company Filing History:
Years Active: 2000-2005
Title: Innovations by Hideki Munakata
Introduction
Hideki Munakata is a notable inventor based in Fukushima, Japan. He has made significant contributions to the field of wafer technology, holding a total of 3 patents. His work focuses on improving the efficiency and cleanliness of wafer storage and processing methods.
Latest Patents
Munakata's latest patents include innovative solutions such as a wafer container and a dusting prevention method. This invention provides a dust generation preventing structure for a wafer storage case, effectively blocking or suppressing the movement of particles that can contaminate wafers. The storage case is made of synthetic resin and features a coating layer of a surfactant to prevent dust generation. Additionally, he has developed a wafer polishing method that protects the wafer holding surface during polishing, ensuring that it remains uncontaminated. His cleaning method efficiently removes any protective film left on the wafer after polishing, making the process more effective.
Career Highlights
Munakata is currently employed at Shin-Etsu Handotai Co., Ltd., where he continues to innovate in the field of semiconductor manufacturing. His expertise in wafer technology has positioned him as a key figure in the industry, contributing to advancements that enhance production quality and efficiency.
Collaborations
He has collaborated with notable coworkers such as Takashi Matsuoka and Naotaka Toyama, further enriching his work and expanding the impact of his inventions.
Conclusion
Hideki Munakata's contributions to wafer technology demonstrate his commitment to innovation and excellence in the semiconductor industry. His patents reflect a deep understanding of the challenges faced in wafer processing and storage, paving the way for future advancements.