Shin-Etsu Handotai Co., Ltd.

Hideki Munakata

Hisashi Masumura

Naotaka Toyama

Takashi Matsuoka

There are provided a dust generation preventing structure of a wafer storage case and a process for preventing dust generation thereof, wherein dust generation is effectively prevented by blocking or suppressing free movement of particles constantly generated from a surface of a wafer storage case of a synthetic resin with a coating layer of a surfactant, and a wafer storing method using the wafer storage case. The wafer storage case of synthetic resin is used for housing wafers, and a surface of the wafer storage case is coated with a coating layer of a coating agent to prevent dust generation from the surface.

Wafer container and dusting prevention method thereof and method for containing wafer

Provided are a wafer polishing method in which, in single side polishing, covering a wafer holding surface (one side surface) with a protective film, a wafer polishing surface (the other side surface) is polished, so that the wafer holding surface can be prevented from being etched and contaminated by a polishing agent; a wafer cleaning method in which the protective film that remains behind on the wafer holding surface after polishing can be efficiently removed, and a waste cleaning solution is easily treated; and a wafer protective film that sufficiently covers the wafer holding surface in polishing but is effectively removed in cleaning. In a wafer polishing method in which a wafer holding surface of one side surface of a wafer is held and a wafer polishing surface of the other side surface thereof is polished while dripping a polishing agent, the wafer polishing surface is polished while covering the wafer holding surface with a synthetic resin protective film of etching resistance against the polishing agent, good adhesiveness to the wafer and a property easy to peel off from the wafer after polishing.

Wafer polishing method, wafer cleaning method and wafer protective film

There are disclosed a method and an apparatus for drying a flat object. At least one flat object, whose surface is covered entirely with adhering water, is placed substantially vertically in at least one groove portion formed in a rack. The rack has a cavity portion formed therein, and the cavity portion communicates with the groove portion through at least one opening. The cavity portion of the rack is depressurized in order to suck water adhering to the surface of the flat object through the opening, thereby drying the flat object. It becomes possible to dry the flat object without causing problems which have been occurred in conventional drying methods.

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Fukushima, Japan

Hideki Munakata