Tochigi, Japan

Hideki Mori

This inventor holds 1 USPTO granted patent. Top assignee: Senju Metal Industry Co., Ltd.. Active years: 2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hideki Mori. Retrieved from https://idiyas.com/inventor/hideki-mori-equ3roft

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2018

Loading Chart...
1 patent (USPTO):Explore Patents

Title: The Innovations of Hideki Mori

Introduction

Hideki Mori is a notable inventor based in Tochigi, Japan. He has made significant contributions to the field of soldering materials, particularly through his innovative patent related to flux and solder paste.

Latest Patents

Mori holds a patent for a flux, solder paste, and solder joint. The purpose of this invention is to provide a flux with improved cleaning properties by suppressing the carbonization of flux residue. The flux contains an organic acid, a thixotropic agent, rosin, and a solvent. Notably, a fatty acid monoalkylol amide with 14-20 carbon atoms is included as the thixotropic agent, added in an amount of 3-10% by weight. Additionally, a dicarboxylic acid with 10 or fewer carbon atoms is incorporated as the organic acid, comprising 4-10% by weight. The solvent is also added in an amount of 30-60% by weight.

Career Highlights

Mori is associated with Senju Metal Industry Co., Ltd., where he has been able to apply his expertise in soldering materials. His work has contributed to advancements in the efficiency and effectiveness of soldering processes.

Collaborations

Mori collaborates with Kazuya Kitazawa, enhancing the innovative efforts within their field.

Conclusion

Hideki Mori's contributions to soldering materials through his patent demonstrate his commitment to innovation and improvement in the industry. His work continues to influence the development of effective soldering solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…