Yamagata, Japan

Hideki Aizawa

This inventor holds 1 USPTO granted patent. Top assignees: Tpr Inc., Tpr Industry Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hideki Aizawa. Retrieved from https://idiyas.com/inventor/hideki-aizawa-0a7bg5ek

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: The Innovations of Hideki Aizawa

Introduction

Hideki Aizawa is a notable inventor based in Yamagata, Japan. He has made significant contributions to the field of engineering, particularly with his innovative workpiece retaining device. His inventions reflect a deep understanding of mechanical design and functionality.

Latest Patents

Aizawa holds 1 patent for his workpiece retaining device. This device is designed to retain a cylindrical workpiece by utilizing a core member that contacts the inner perimeter face of the retained portion. The device also includes a pressing member that applies pressure to the outer perimeter face, ensuring stability and alignment during operation. The aligning member allows for radial movement in response to the pressing force, enhancing the device's adaptability.

Career Highlights

Throughout his career, Aizawa has worked with various companies, including TPR Inc. and TPR Industry Co., Ltd. His experience in these organizations has contributed to his expertise in developing innovative solutions for complex engineering challenges.

Collaborations

Aizawa has collaborated with Koji Okuyama, further enriching his work and expanding the scope of his inventions.

Conclusion

Hideki Aizawa's contributions to the field of engineering through his innovative workpiece retaining device exemplify his dedication to advancing technology. His career and collaborations highlight the importance of teamwork in the pursuit of innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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