Hidekazu Sawai

Title: Innovations of Hidekazu Sawai

Introduction

Hidekazu Sawai is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of laser technology, holding a total of 5 patents. His work focuses on enhancing the precision and efficiency of laser machining processes.

Latest Patents

One of his latest innovations is the "Three-dimensional laser beam machine." This machine features a head structure that allows for the rotation of both the rotation axis and the attitude axis without moving the processing point. It includes means for storing the current angles of these axes and calculating a nozzle direction vector based on these angles. Additionally, it determines the angles of the nozzle in both vertical and horizontal directions and displays the determined angles.

Another notable patent is the "Method for machining wiring board with laser beam and device for same." This method involves using a light shielding body to shield a portion of the laser beam in the light path between the laser oscillator and the machining lens. The laser beam is then irradiated onto the light shielding body, allowing the non-shielded portion of the beam to pass through to the machining lens for effective board machining.

Career Highlights

Hidekazu Sawai is associated with Mitsubishi Electric Corporation, where he continues to innovate and develop advanced laser technologies. His work has significantly impacted the efficiency of laser machining in various applications.

Collaborations

He has collaborated with notable colleagues such as Tsukasa Matsuno and Mitsunobu Oshimura, contributing to the advancement of laser technology through teamwork and shared expertise.

Conclusion

Hidekazu Sawai's contributions to laser technology through his patents and collaborations highlight his role as a leading inventor in the field. His innovations continue to shape the future of laser machining processes.