Mitsubishi Denki Kabushiki Kaisha

Hidekazu Sawai

Masato Matsubara

Miki Kurosawa

Eikichi Hayashi

Tsukasa Matsuno

Mitsunobu Oshimura

Masaki Tsukamoto

Tomonari Mukae

In a three-dimensional laser beam machine having a head structure in which a processing point is not moved when a rotation axis and an attitude axis are rotated, the machine has: means for storing information of current angles of the rotation axis and the attitude axis, and calculating a nozzle direction vector from the angles; means for, based on the nozzle direction vector, determining angles of a nozzle in a vertical direction and a horizontal direction consisting of a Z-axis of an orthogonal coordinate system; and means for displaying the determined nozzle angles.

Three-dimensional laser beam machine

A wiring board is machined by providing a light shielding body for shielding a portion of a laser beam in a light path between a laser oscillator and a machining lens, irradiating the laser beam onto the light shielding body, and introducing a non-shielded portion of the laser beam having passed through the light shielding body to the machining lens.

Method for machining wiring board with laser beam and device for same

Method and device for machining a wiring board utilizing light shielding of a laser beam to select a machined tapering

A beam confinement subsystem for an optical scanning system of a laser beam machine having a laser beam transfer path includes an expandable light path sealing and protecting member surrounding a portion of the laser beam transfer path, and a pressure adjusting buffer directly coupled to the expandable light path sealing and protecting member. Preferably, the pressure adjusting buffer including an expandable, airtight thin-film material. Additionally, the beam confinement can include a pressurized purge gas supply tank directly connected to the expandable light path sealing and protecting member to thereby provide greater protection from contamination to the laser beam transfer path.

Laser beam machine based on optically scanning system

In a laser machining apparatus and method according to the present invention, a chip conveyor provided under the machining head parallel to the moving direction of the machining head recovers chips dropping near a movable area of a machining head, the chip tray provided in a section where the chip conveyor does not exit, receives chips dropping in a movable area of the machining table where the chip conveyor does not exist, and brushes provided under the machining table move along with the machining table to clean off chips stored in the chip trays and drop the chips onto the chip conveyor.

Growing community of inventors

Tokyo, Japan

Hidekazu Sawai