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Title: Innovations of Hidekazu Miyabe
Introduction
Hidekazu Miyabe is a notable inventor based in Hiki-gun, Japan. He has made significant contributions to the field of resin compositions and electronic components. With a total of 3 patents to his name, his work focuses on developing materials that enhance the performance and reliability of electronic devices.
Latest Patents
Miyabe's latest patents include a curable resin composition designed to provide a cured product with high heat resistance, low dielectric loss tangent, and strong adhesion to conductors. This innovative composition consists of an epoxy resin and a compound with an active ester group, maintaining a specific ratio of epoxy groups to active ester groups. Additionally, he has developed a photocurable and thermosetting resin composition that incorporates a carboxyl group-containing resin, a photopolymerization initiator, a reactive diluent, and an epoxy compound. This formulation is designed to create printed circuit boards with enhanced properties.
Career Highlights
Throughout his career, Miyabe has worked with prominent companies such as Nippon Sheet Glass Company, Limited and Taiyo Ink Mfg. Co., Ltd. His experience in these organizations has allowed him to refine his expertise in resin technology and electronic components.
Collaborations
Miyabe has collaborated with notable colleagues, including Gen Itokawa and Atsushi Mashiko. These partnerships have contributed to the advancement of his research and innovations in the field.
Conclusion
Hidekazu Miyabe's contributions to resin compositions and electronic components demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of material science and its applications in technology.