Nippon Sheet Glass Company, Limited

Taiyo Ink Manufacturing Co., Ltd.

Taiyo Ink Mfg. Co., Ltd.

Taiyo Holdings Co., Ltd.

Hidekazu Miyabe

Hiroyuki Nemoto

Shoji Minegishi

Hideaki Kojima

Gen Itokawa

Yoshitomo Aoyama

Atsushi Mashiko

Kazuhisa Yamoto

Shouji Minegishi

Naoki Yoneda

Yoshitaka Hirai

To provide a curable resin composition, from which a cured product having high heat resistance, a low dielectric loss tangent, high adhesion to a conductor can be obtained. A dry film, a resin-clad copper foil, a cured product, and an electronic component containing the curable resin composition are to be provided. A curable resin composition containing (A) an epoxy resin and (B) a compound having an active ester group is obtained, which has ratio of the total amount of epoxy group(s) in (A) the epoxy resin/the total amount of active ester group(s) in (B) the compound having an active ester group in the composition in the range of 0.2 to 0.6. A dry film, a resin-clad copper foil, a cured product, and an electronic component containing the curable resin composition are also obtained.

Curable resin composition, dry film, resin-clad copper foil, cured product, and electronic component

A photocurable and thermosetting composition comprises (A) a carboxyl group-containing resin having at least one carboxyl group in its molecule, (B) a photopolymerization initiator having an oxime linkage represented by the following general formula (I), (C) a reactive diluent, and (D) an epoxy compound having two or more epoxy groups in its molecule. The above-mentioned photopolymerization initiator (B) is incorporated into a formulation which is different from at least a formulation into which the above-mentioned carboxyl group-containing resin (A) and the above-mentioned reactive diluent (C) are incorporated to formulate a system comprising at least two parts. 

Photocurable and thermosetting resin composition and printed circuit boards made by using the same

An alkali-developable black photosensitive resin composition for forming a light-shielding barrier wall which comprises, as indispensable components, (A) a carboxyl group-containing photosensitive prepolymer, (B) a photopolymerization initiator, (C) a black pigment, and (D) light-transmitting fine particles. By the use of this composition, light-shielding barrier walls () having sufficient light-shielding properties and a height of not less than 20 &#x3bc;m can be formed by photolithography, without causing undercutting during development. In a preferred embodiment, the black pigment (C) is a metal oxide, preferably iron oxide, and the fine particles (D) are inorganic fine particles having a refractive index of 1.40-1.90, preferably silica.

Alkali-developable black photosensitive resin composition for forming light-shielding barrier wall

Growing community of inventors

Hiki-gun, Japan

Hidekazu Miyabe