Sendai, Japan

Hidechika Ito

This inventor holds 1 USPTO granted patent. Top assignees: Konica Minolta, Inc., Tohoku University. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hidechika Ito. Retrieved from https://idiyas.com/inventor/hidechika-ito

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Innovations of Hidechika Ito

Introduction

Hidechika Ito is a notable inventor based in Sendai, Japan. He has made significant contributions to the field of three-dimensional shape measurement technology. His innovative approach has led to the development of a unique method and apparatus for accurately measuring the three-dimensional shapes of objects.

Latest Patents

Hidechika Ito holds 1 patent for his invention titled "Three-dimensional shape measuring method and three-dimensional shape measuring apparatus." This patent describes a method that includes projecting first and second images onto a target object, capturing images while these projections are active, and identifying the three-dimensional shape of the object based on the captured data.

Career Highlights

Throughout his career, Hidechika Ito has worked with prominent organizations such as Konica Minolta, Inc. and Tohoku University. His experience in these institutions has allowed him to refine his skills and contribute to advancements in measurement technology.

Collaborations

Hidechika Ito has collaborated with notable colleagues, including Shingo Kagami and Koichi Hashimoto. Their joint efforts have further enhanced the development of innovative technologies in their field.

Conclusion

Hidechika Ito's work in three-dimensional shape measurement exemplifies the impact of innovation in technology. His contributions continue to influence the industry and inspire future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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