Osaka, Japan

Hideaki Minamiyama

USPTO Granted Patents = 4 

 

Average Co-Inventor Count = 2.9

ph-index = 1

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 2011-2024

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4 patents (USPTO):Explore Patents

Title: Innovations by Hideaki Minamiyama

Introduction

Hideaki Minamiyama is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of electronics through his innovative patents. With a total of four patents to his name, Minamiyama's work focuses on enhancing the performance and reliability of electronic components.

Latest Patents

Minamiyama's latest patents include an electrically conductive adhesive and an electronic circuit utilizing this adhesive. The primary objective of his invention is to provide an electrically conductive adhesive that minimizes the rise in electric resistance at the joining part between an electronic component and a substrate, especially under high temperature and high humidity conditions. The adhesive comprises an electrically conductive filler with a specific coating layer of silver, ensuring a low specific resistance value. Additionally, he has developed a composite conductive particle that enhances the performance of conductive resin compositions.

Career Highlights

Throughout his career, Hideaki Minamiyama has worked with Toyo Aluminium Kabushiki Kaisha, where he has contributed to various innovative projects. His experience in the industry has allowed him to refine his skills and develop groundbreaking technologies that address the challenges faced in electronic manufacturing.

Collaborations

Minamiyama has collaborated with notable colleagues such as Kazunori Koike and Toshio Nakatani. These partnerships have fostered a creative environment that has led to the development of advanced materials and methods

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