The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2024
Filed:
Jul. 29, 2021
Toyo Aluminium Kabushiki Kaisha, Osaka, JP;
Toshio Nakatani, Osaka, JP;
Hideaki Minamiyama, Osaka, JP;
TOYO ALUMINUM KABUSHIKI KAISHA, Osaka, JP;
Abstract
Objects of the present invention are to provide an electrically conductive adhesive which is capable of suppressing a rise in an electric resistance value of a joining part between an electronic component and a substrate under high temperature and high humidity while a specific resistance value is suppressed to be low; an electronic circuit using such electrically conductive adhesive; and a method for manufacturing such electronic circuit. According to the present invention, provided is the electrically conductive adhesive which includes an electrically conductive filler, a surface of the electrically conductive filler being a coating layer including silver, a compounded amount of the electrically conductive filler being 29.0 vol. % to 63.0 vol. % with respect to the electrically conductive adhesive, a compounded amount of the silver being 3.5 vol. % to 7.0 vol. % with respect to the electrically conductive adhesive. In addition, also provided are an electronic circuit using the electrically conductive adhesive of the present invention and a method for manufacturing such electronic circuit.