Toyo Aluminium Kabushiki Kaisha

Toyo Aluminum Kabushiki Kaisha

Hideaki Minamiyama

Toshio Nakatani

Kazunori Koike

Yoshiki Hashizume

Takayuki Nakao

Taro Morimitsu

Masakazu Nakamura

Kazuya Minami

Miki Fujii

Objects of the present invention are to provide an electrically conductive adhesive which is capable of suppressing a rise in an electric resistance value of a joining part between an electronic component and a substrate under high temperature and high humidity while a specific resistance value is suppressed to be low; an electronic circuit using such electrically conductive adhesive; and a method for manufacturing such electronic circuit. According to the present invention, provided is the electrically conductive adhesive which includes an electrically conductive filler, a surface of the electrically conductive filler being a coating layer including silver, a compounded amount of the electrically conductive filler being 29.0 vol. % to 63.0 vol. % with respect to the electrically conductive adhesive, a compounded amount of the silver being 3.5 vol. % to 7.0 vol. % with respect to the electrically conductive adhesive. In addition, also provided are an electronic circuit using the electrically conductive adhesive of the present invention and a method for manufacturing such electronic circuit.

Electrically conductive adhesive, electronic circuit using the same, and method for manufacturing such electronic circuit

A composite conductive particle according to the present invention includes a first conductive particle having a particle diameter of greater than or equal to 0.1 &#x3bc;m and less than or equal to 50 &#x3bc;m; and a second conductive particle adhering to the surface of the first conductive particle and having a particle diameter of greater than or equal to 50 nm and less than or equal to 1000 nm, and the first conductive particle is composed of a first particle and a first metal coating covering the surface of the first particle, the second conductive particle is composed of a second particle and a second metal coating covering the surface of the second particle, a particle diameter of the first conductive particle is larger than a particle diameter of the second conductive particle, and an adhering rate of the second conductive particle.

Composite conductive particle, conductive resin composition containing same and conductive coated article

The present invention relates to conductive particles. The conductive particles contain core particles containing aluminum and a metal film covering the core particles, the metal film is higher in conductivity than the core particles, and a surface coverage of the core particles with the metal film is not lower than 80%.

Conductive particles, method of manufacturing the same, conductive resin composition containing the same, and conductive coated object

This invention provides a colored metallic pigment, which can develop a variety of colors and varied interference colors while maintaining good lightfastness, weatherfastness and hiding power, a process for producing the same, a coating composition containing the colored metallic pigment and capable of providing a coating film having excellent finished appearance, and a cosmetic preparation containing the colored metallic pigment, having excellent hiding power, and capable of providing sharp hue. The colored metallic pigment comprises at least a metallic pigment, an amorphous silicon oxide film layer provided on the surface of the metallic pigment, a metal layer provided on the surface of the amorphous silicon oxide film layer, and metallic particles provided on the surface of the metal layer. The metallic particles are provided so as to directly cover a part of the surface of the metal layer. In the colored metallic pigment, the metal layer preferably comprises at least one metal selected from Sn, Pd, Pt and Au. The metallic particle preferably comprises at least one metal selected from Cu, Ni and Ag.

Growing community of inventors

Osaka, Japan

Hideaki Minamiyama