This inventor holds 1 USPTO granted patent. Top assignee: Okuno Chemical Industry Co., Ltd.. Active years: 1979.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1979
Title: Innovations of Hideaki Koriyama
Introduction
Hideaki Koriyama is a notable inventor based in Nara, Japan. He has made significant contributions to the field of chemical engineering, particularly in the area of copper plating. His innovative work has led to the development of a unique composition that enhances the efficiency of chemical copper plating processes.
Latest Patents
Koriyama holds a patent for "Compositions for chemical copper plating." This composition features a pH range of 12 to 14 and includes a boron hydride compound as a reducing agent, a water-soluble copper compound, and a copper complexing agent. The copper complexing agent is characterized by hydroxyalkyl-substituted ethylenediamines and hydroxyalkyl-substituted diethylenetriamines, which contribute to the effectiveness of the plating process. He has 1 patent to his name.
Career Highlights
Throughout his career, Koriyama has been associated with Okuno Chemical Industry Co., Ltd., where he has applied his expertise in chemical compositions. His work has been instrumental in advancing the company's product offerings and enhancing their competitive edge in the market.
Collaborations
One of his notable collaborators is Yasunori Arisato, with whom he has worked closely on various projects related to chemical innovations.
Conclusion
Hideaki Koriyama's contributions to the field of chemical copper plating exemplify the impact of innovative thinking in industrial applications. His patent and ongoing work continue to influence advancements in chemical engineering.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile