The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 1979
Filed:
Dec. 28, 1976
Yasunori Arisato, Daito, JP;
Hideaki Koriyama, Nara, JP;
Okuno Chemical Industry Company, Limited, Osaka, JP;
Abstract
A composition for chemical copper plating having a pH of 12 to 14 and containing a boron hydride compound serving as a reducing agent, a water-soluble copper compound and a copper complexing agent, the composition being characterized in that the copper complexing agent is at least one of hydroxyalkyl-substituted ethylenediamines represented by the formula ##STR1## wherein R.sub.1, R.sub.2, R.sub.3 and R.sub.4 are the same or different and are each unsubstituted lower alkyl or hydroxyl- and/or carboxyl-substituted lower alkyl, and at least one of R.sub.1, R.sub.2, R.sub.3 and R.sub.4 is hydroxyl-substituted lower alkyl, and hydroxyalkyl-substituted diethylenetriamines represented by the formula ##STR2## wherein R.sub.5, R.sub.6, R.sub.7 and R.sub.8 are the same or different and are each unsubstituted lower alkyl or hydroxyl-and/or carboxyl substituted lower alkyl, R.sub.9 is hydrogen or unsubstituted lower alkyl or hydroxyl-and/or carboxyl-substituted lower alkyl, and at least one of R.sub.5, R.sub.6, R.sub.7, R.sub.8 and R.sub.9 is hydroxyl-substituted lower alkyl.