This inventor holds 1 USPTO granted patent. Top assignee: Applied Materials, Inc.. Active years: 2003.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2003
Title: Innovations by Hideaki Kondo
Introduction
Hideaki Kondo is a notable inventor based in Kumagaya, Japan. He has made significant contributions to the field of substrate support technology. His innovative approach has led to the development of a unique method for fabricating substrate supports.
Latest Patents
Kondo holds a patent for a "Substrate support and method of fabricating the same." This patent outlines a method that includes assembling a subassembly with a first reinforcing member and a heating element. The subassembly is supported at least 40mm from the bottom of a mold, encapsulated with molten aluminum, and subjected to pressure. An alternative method involves a stud disposed through a heating element, which is sandwiched between two reinforcing members. This method also includes encapsulating the subassembly in molten aluminum to form a casting and creating a hole in the casting by removing a portion of the stud.
Career Highlights
Kondo is currently employed at Applied Materials, Inc., where he continues to innovate in the field of substrate technology. His work has been instrumental in advancing the methods used in the fabrication of substrate supports.
Collaborations
Kondo collaborates with talented coworkers, including Naomi Matsumura and Masahiko Kowaka. Their combined expertise contributes to the innovative projects at Applied Materials, Inc.
Conclusion
Hideaki Kondo's contributions to substrate support technology exemplify the spirit of innovation. His patent and ongoing work at Applied Materials, Inc. highlight his commitment to advancing this field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
