This inventor holds 3 USPTO granted patents, plus 2 CIPO patents and 3 EPO patents. Top assignee: United Monolithic Semiconductors Gmbh. Active years: 2013-2021.
Company Filing History:
Years Active: 2013-2021
Title: Hermann Stieglauer: Innovator in Semiconductor Technology
Introduction
Hermann Stieglauer is a notable inventor based in Blaustein, Germany. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on innovative methods for producing electronic components and semiconductor wafers.
Latest Patents
Stieglauer's latest patents include a method for producing an at least partly packaged semiconductor wafer. This method involves providing a semiconductor wafer with components on its upper face and a cover disc that partially covers the wafer. The surface of the cover disc is functionalized to form a functional layer, which is then joined to the upper face of the semiconductor wafer. The functional layer is activated through simultaneous chemical bonding, creating a housing for the semiconductor wafer. Another significant patent relates to the production of an electronic component featuring a GaAs semiconductor substrate. This component includes semiconductor components on the front side and a multilayer backside metallization, which comprises an Au layer as a bonding layer.
Career Highlights
Hermann Stieglauer is currently associated with United Monolithic Semiconductors GmbH, where he continues to advance semiconductor technologies. His expertise and innovative approaches have positioned him as a key figure in the industry.
Collaborations
Some of his notable coworkers include Guenter Jonsson and Dag Behammer, who have collaborated with him on various projects within the semiconductor field.
Conclusion
Hermann Stieglauer's contributions to semiconductor technology through his patents and work at United Monolithic Semiconductors GmbH highlight his role as an influential inventor in the industry. His innovative methods continue to shape the future of electronic components.