The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2021
Filed:
May. 03, 2019
United Monolithic Semiconductors Gmbh, Ulm, DE;
Hermann Stieglauer, Blaustein, DE;
United Monolithic Semiconductors GmbH, Ulm, DE;
Abstract
A method for producing an at least partially housed semiconductor wafer is provided. This method comprises the steps of providing a semiconductor wafer which has components on its upper face and providing a cover disc, the surface of which at least partially covers the semiconductor wafer. After functionalizing the surface of the cover disc to form a functional layer, the upper face of the semiconductor wafer and the surface of the cover disc are joined together, followed by activating the functional layer using simultaneous chemical bonding of the semiconductor wafer and the cover disc such that the cover disc forms a housing for the semiconductor wafer.