Bolken, Switzerland

Herbert Villiger

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Bystronic Laser Ag. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Herbert Villiger. Retrieved from https://idiyas.com/inventor/herbert-villiger

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

 

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Herbert Villiger - Innovator in Worktable Technology

Introduction

Herbert Villiger is a notable inventor based in Bolken, Switzerland. He has made significant contributions to the field of worktable technology, particularly in the detection of foreign parts and deposits that can affect the quality of cutting processes.

Latest Patents

Villiger holds a patent for a device designed to check for foreign parts and/or deposits on support elements of a worktable. This invention is crucial for ensuring that flat workpieces are cut accurately using laser or water jet technology. The device features a sensor that detects foreign parts and deposits in the space between two respective support elements, which are arranged parallel to one another.

Career Highlights

Herbert Villiger is associated with Bystronic Laser AG, a company known for its innovative solutions in laser cutting technology. His work at Bystronic has allowed him to focus on enhancing the efficiency and safety of cutting processes in various industrial applications.

Collaborations

Villiger collaborates with Stefan Alfons Jacobi, a fellow innovator in the field. Their combined expertise contributes to the advancement of technology in worktable systems.

Conclusion

Herbert Villiger's contributions to worktable technology through his innovative patent demonstrate his commitment to improving industrial processes. His work continues to influence the field and enhance the capabilities of cutting technologies.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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