Henry Guo

Title: Henry Guo: Innovator in Component Carrier Technology

Introduction

Henry Guo is a prominent inventor based in Suqian, China. He has made significant contributions to the field of component carrier technology, holding a total of 2 patents. His work focuses on innovative methods and structures that enhance the functionality and efficiency of electronic components.

Latest Patents

Henry Guo's latest patents include two notable inventions. The first patent, titled "Component carrier having component covered with ultra-thin transition layer," describes a method of manufacturing a component carrier. This method involves providing a laminated stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. It also includes at least partially covering a component with a transition layer that has a thickness ranging from 0.5 nm to 1 μm, followed by assembling the component with the stack. The second patent, "Component carrier comprising dielectric structures with different physical properties," details a component carrier that features a stack with at least one electrically conductive layer structure and multiple electrically insulating layer structures. This design incorporates a component embedded in the stack, with the insulating layer structures differing in at least one physical property.

Career Highlights

Henry Guo is currently employed at AT&S (China) Co. Ltd., where he continues to develop innovative solutions in the field of electronics. His expertise in component carrier technology has positioned him as a key player in advancing the capabilities of electronic devices.

Collaborations

Henry collaborates with talented coworkers, including Kim Liu and Mikael Tuominen. Their combined efforts contribute to the innovative environment at AT&S, fostering advancements in technology.

Conclusion

Henry Guo's contributions to component carrier technology through his patents and work at AT&S highlight his role as a significant inventor in the electronics industry. His innovative approaches continue to shape the future of electronic components.