Company Filing History:

19 out of 29,297

Texas Instruments Corporation

Years Active: 1983-2008

Loading Chart...

20 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7416789 - Refractory metal substrate with improved thermal conductivity (2008-08-26),

2. 5653379 - Clad metal substrate (1997-08-05),

3. 5536906 - Package for integrated circuits (1996-07-16),

4. 5435058 - Hybrid/microwave enclosures and method of making same (1995-07-25),

5. 5422788 - Technique for enhancing adhesion capability of heat spreaders in molded (1995-06-06),

6. 5362680 - Technique for enhancing adhesion capability of heat spreaders in molded (1994-11-08),

7. 5359224 - Insulated lead frame for integrated circuits and method of manufacture (1994-10-25),

8. 5310520 - Circuit system, a composite material for use therein, and a method of (1994-05-10),

9. 5276423 - Circuit units, substrates therefor and method of making (1994-01-04),

10. 5138114 - Hybrid/microwave enclosures and method of making same (1992-08-11),

11. 5126511 - Copper cored enclosures for hybrid circuits (1992-06-30),

12. 5055967 - Substrate for an electrical circuit system and a circuit system using (1991-10-08),

13. 5050040 - Composite material, a heat-dissipating member using the material in a (1991-09-17),

14. 5039335 - Composite material for a circuit system and method of making (1991-08-13),

15. 5036584 - Method of manufacture of copper cored enclosures for hybrid circuits (1991-08-06),

Certainly! Here is a draft article on inventor Henry F Breit:

Title: The Innovative Mind of Henry F Breit

Introduction:

Henry F Breit, a prolific inventor based in Attleboro, MA (US), is known for his remarkable contributions in the field of semiconductor and integrated circuit components. With an impressive portfolio of 20 patents, Breit has played a significant role in advancing technological solutions for electronic devices.

Latest Patents:

Among his latest patents, one notable invention is the "Refractory Metal Substrate with Improved Thermal Conductivity." This substrate is designed to enhance thermal conductivity in semiconductor and integrated circuit components, making it invaluable for optimizing electronic devices. Another groundbreaking invention is the "Clad Metal Substrate," which involves bonding ceramic layers to metal cores, tailored to their respective temperature coefficients of expansion.

Career Highlights:

Breit has had a distinguished career, including tenures at renowned companies such as Texas Instruments Corporation and H.C. Starck GmbH. His expertise and innovative approach have led to the development of cutting-edge technologies that have reshaped the industry.

Collaborations:

Throughout his career, Breit has collaborated with esteemed professionals in the field. Notably, he has worked closely with individuals like James A Forster and Joseph M Gondusky, leveraging their collective expertise to push the boundaries of innovation further.

Conclusion:

In conclusion, Henry F Breit stands out as a visionary inventor who has left an indelible mark on the realm of semiconductor and integrated circuit components. His relentless pursuit of excellence and commitment to technological advancement continue to inspire future generations of innovators in the industry.

This text is generated by artificial intelligence and may not be accurate.

Please report any incorrect information to support@idiyas.com