The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 1994
Filed:
Jul. 15, 1993
Katherine G Heinen, Dallas, TX (US);
Henry F Breit, Attleboro, MA (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
An insulated lead frame is disclosed. The preferred embodiment contains a lead over chip lead frame having an aluminum oxide insulator on portions of the power supply busses where no electrical connections will be made. The aluminum oxide may be easily deposited by an arc deposition process such as by plasma deposition. A mask prohibits the aluminum oxide from coating the places on the power supply busses where electrical connection, such as by wire bond, will be made. Wire bonds crossing over the power supply busses as they connect bond pads to the lead fingers of the lead frame are therefore less likely to short to the insulated power supply busses. A semiconductor packaged device having an aluminum oxide coating to the underside of the chip support pad is also disclosed. The aluminum oxide coating promotes adhesion between the chip support pad and the encapsulant, that is typically plastic, thereby preventing the chance of delamination and package cracking.