Nijmegen, Netherlands

Henricus A Laarhoven

This inventor holds 1 USPTO granted patent. Top assignee: U.S. Philips Corporation. Active years: 1993.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Henricus A Laarhoven. Retrieved from https://idiyas.com/inventor/henricus-a-laarhoven

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 1993

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1 patent (USPTO):Explore Patents

Title: Henricus A Laarhoven: Innovator in Semiconductor Technology

Introduction

Henricus A Laarhoven is a notable inventor based in Nijmegen, Netherlands. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique semiconductor device that enhances electrical connections.

Latest Patents

Henricus A Laarhoven holds a patent for a semiconductor device having a clamping support. This device comprises a support with a groove that contains conductors extending around it. The semiconductor element is clamped within the groove, ensuring both mechanical and electrical connections in a single, efficient process.

Career Highlights

Laarhoven is associated with U.S. Philips Corporation, where he has applied his expertise in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor devices.

Collaborations

He has collaborated with notable colleagues such as Johannes M Verspeek and Peter W Van De Water, contributing to various projects within the semiconductor field.

Conclusion

Henricus A Laarhoven's contributions to semiconductor technology exemplify innovation and efficiency in electrical connections. His work continues to influence the industry and inspire future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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