U.S. Philips Corporation

Henricus A Laarhoven

Peter W Van De Water

Kornelis Boer

Johannes M Verspeek

Jan Van Middendorp

A semiconductor device comprising a support (1) provided with a groove (2) having walls (3 and 4), on which conductors (6 and 7) are present, which conductors extend at least partially around the support (1), and with a semiconductor element (11) which is present in the groove and makes electrical contact with the conductors on the walls. The semiconductor element (11) is clamped in the groove (2), thus making electrical contact with conductors (6 and 7) on walls (3 and 4). Since the semiconductor element (11) is held clamped-in between the conductors (6 and 7) on the walls (3 and 4), it is achieved that both a mechanical and an electrical connection is realized between semiconductor element (11) and support (1) in a single process step and in a simple manner.

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Nijmegen, Netherlands

Henricus A Laarhoven