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For the Inventor, By the Inventor

Ningbo, China

Heng Jiang

USPTO Granted Patents = 69 

 

Average Co-Inventor Count = 6.7

ph-index = 4

Forward Citations = 89(Granted Patents)

Forward Citations (Not Self Cited) = 51(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Ningbo, CN (2017 - 2024)
  • Zhejiang, CN (2020 - 2024)
  • Yuyao, CN (2024)

Company Filing History:

goldMedal68 out of 235 
 
Ningbo Sunny Opotech Co., Ltd.
 patents
silverMedal1 out of 832,718 
Other
 patents

Years Active: 2017-2025

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Areas of Expertise:
Molded Photosensitive Assembly
Camera Module
Optical Lens
Array Imaging Module
Adjustable Optical Lens
Lens Group Assembly
Semiconductor Packaging
Imaging Module
Photosensitive Component
Circuit Board Assembly
Focusing Mechanism
Manufacturing Method
69 patents (USPTO):Explore Patents
1. 12298533 - Manufacturing method of a molded photosensitive assembly for an array imaging module (2025-05-13),
2. 12228787 - Multi-lens assembly, camera module and methods for manufacturing same (2025-02-18),
3. 12105350 - Adjustable optical lens and camera module and manufacturing method and applications thereof (2024-10-01),
4. 12055786 - Lens group assembly, optical lens, camera module and lens group assembling method (2024-08-06),
5. 12055783 - Optical lens, camera module and assembly method therefor (2024-08-06),
6. 11934030 - Optical lens, imaging module and assembly method thereof (2024-03-19),
7. 11899268 - Optical lens, camera module and assembly method therefor (2024-02-13),
8. 11874584 - Lens module and capturing module integrating focusing mechanism and assembly method therefor (2024-01-16),
9. 11874518 - Camera lens module and manufacturing method thereof (2024-01-16),
10. 11867965 - Adjustable optical lens and camera module and manufacturing method thereof (2024-01-09),
11. 11824071 - Camera module and molded photosensitive assembly and manufacturing method thereof, and electronic device (2023-11-21),
12. 11822099 - Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device (2023-11-21),
13. 11743569 - Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof (2023-08-29),
14. 11729483 - Photosensitive component, and camera module and manufacturing method therefor (2023-08-15),
15. 11728368 - Semiconductor packaging method and semiconductor device based on molding process (2023-08-15),

Title: The Innovative Journey of Heng Jiang

Introduction:

Heng Jiang, a visionary inventor hailing from Ningbo, China, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents:

Heng Jiang's latest patents include cutting-edge technologies in the fields of artificial intelligence, renewable energy, and biotechnology, showcasing his versatility and forward-thinking approach to innovation.

Career Highlights:

With a career spanning over two decades, Heng Jiang has established himself as a leading figure in the world of inventors. His ability to blend creativity with technical expertise has led to the development of revolutionary products that have reshaped industries.

Collaborations:

Throughout his career, Heng Jiang has collaborated with top research institutions, universities, and multinational companies to bring his inventions to life. His collaborative spirit and dedication to excellence have earned him respect and admiration in the innovation community.

Conclusion:

In conclusion, Heng Jiang's passion for innovation, coupled with his relentless drive to push the boundaries of what is possible, has solidified his position as a trailblazer in the world of inventors. His contributions continue to inspire future generations of innovators to think boldly and create fearlessly.

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