The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2023
Filed:
Feb. 23, 2022
Ningbo Sunny Opotech Co., Ltd., Zhejiang, CN;
Mingzhu Wang, Ningbo, CN;
Zhenyu Chen, Ningbo, CN;
Nan Guo, Ningbo, CN;
Bojie Zhao, Ningbo, CN;
Takehiko Tanaka, Ningbo, CN;
Zhen Huang, Ningbo, CN;
Zhongyu Luan, Ningbo, CN;
Heng Jiang, Ningbo, CN;
NINGBO SUNNY OPOTECH CO., LTD., Zhejiang, CN;
Abstract
A molded photosensitive assembly of a camera module includes at least one supporting member formed by a first substance, at least one photosensitive element, at least one circuit board, at least one set of wires electrically connecting the photosensitive element to the circuit board, and at least one molded base. Two ends of each of the wires are respectively connected to a chip connector of the photosensitive element and a circuit connector of the circuit board. The molded base is formed by a second substance and comprises a molded body and has at least one light window, wherein the photosensitive element and the wires are protected by a supporting member which is provided for avoiding an upper mold of a molding-die pressing on the wires during the molding process.