Company Filing History:
Years Active: 2012-2015
Title: Hejin Liu: Innovator in Semiconductor Technology
Introduction
Hejin Liu is a prominent inventor based in Tianjin, China. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His innovative work has paved the way for advancements in semiconductor devices and packaging.
Latest Patents
One of Hejin Liu's latest patents is for a semiconductor device assembled using two lead frames. This invention allows for a more efficient configuration of lead frames, enabling an array of first lead frames to be used with more devices than traditional methods. The second lead frame provides bent leads, which can be attached after the dies have been mounted and encapsulated. Another notable patent is for a three-dimensional (3D) package that includes a helix substrate. This design features a columnar part with a helix arrangement of steps, allowing for the attachment of semiconductor integrated circuits on supporting surfaces.
Career Highlights
Hejin Liu is currently employed at Freescale Semiconductor, Inc., where he continues to develop innovative semiconductor solutions. His work has been instrumental in enhancing the performance and efficiency of semiconductor devices.
Collaborations
Hejin Liu has collaborated with several talented individuals in his field, including Meiquan Huang and Huan Wang. These collaborations have contributed to the success of his projects and the advancement of semiconductor technology.
Conclusion
Hejin Liu's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the industry. His innovative designs continue to influence the development of advanced semiconductor devices.