The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2014
Filed:
Mar. 22, 2013
Applicants:
Huan Wang, Tianjin, CN;
Meiquan Huang, Tianjin, CN;
Hejin Liu, Tianjin, CN;
Inventors:
Assignee:
Freescale Semiconductor, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/04 (2006.01); H01L 23/34 (2006.01); H01L 23/48 (2006.01); H05K 1/18 (2006.01); H05K 1/14 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H05K 1/141 (2013.01); H05K 1/144 (2013.01); H05K 3/284 (2013.01); H05K 2201/041 (2013.01); H05K 2201/09027 (2013.01);
Abstract
A three dimensional (3D) package includes a helix substrate having a columnar part including a top surface, a bottom surface and a sidewall, and a plurality of steps arranged along the sidewall of the columnar part in the form of a helix. Semiconductor integrated circuits (dies) may be attached on supporting surfaces of the steps. The columnar part, the steps and the dies can be covered with a mold compound. I/Os are formed at either the sides of the steps and/or the top and/or bottom of the columnar part.