The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2015
Filed:
Nov. 26, 2014
Huan Wang, Tianjin, CN;
Hejin Liu, Tianjin, CN;
Weiping Sun, Tianjin, CN;
FREESCALE SEMICONDUCTOR, INC., Austin, TX (US);
Abstract
A packaged semiconductor device is assembled using a first lead frame upon which a die is mounted and encapsulated and a second lead frame that provides bent leads for the device. By using two different lead frames, an array of the first lead frames can be configured with more lead frames for more devices than a comparably sized lead frame array of the prior art because the first lead frame array does not need to provide the leads for the packaged devices. Instead, the leads are provided by the second lead frame array, which can be attached to the first lead frame array after the dies have been mounted and encapsulated on the first lead frame array.