Munich, Germany

Heinz Nolden

This inventor holds 1 USPTO granted patent. Top assignee: Siegfried Hofmann Gmbh. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Heinz Nolden. Retrieved from https://idiyas.com/inventor/heinz-nolden-8jk16de9

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Heinz Nolden

Introduction

Heinz Nolden is a notable inventor based in Munich, Germany. He has made significant contributions to the field of soldering technology. His innovative approach has led to the development of a unique device that enhances the soldering process.

Latest Patents

Heinz Nolden holds a patent for a "Device for soldering." This device is particularly designed for reflow soldering of at least one assembly. It features a process chamber arrangement that includes at least two process chambers. These chambers are utilized for preparing, carrying out, and post-processing soldering methods. The design of the chambers is stack-like, allowing for efficient use of space and resources.

Career Highlights

Heinz Nolden is associated with Siegfried Hofmann GmbH, where he applies his expertise in soldering technology. His work has been instrumental in advancing the capabilities of soldering devices. With a focus on innovation, he continues to contribute to the field.

Collaborations

Heinz collaborates with talented individuals such as Daniel Feseker and Michael Deuerling. Their combined efforts foster a creative environment that drives technological advancements.

Conclusion

Heinz Nolden's contributions to soldering technology exemplify the spirit of innovation. His patent and collaborative efforts highlight the importance of teamwork in achieving technological progress.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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