The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2024

Filed:

Jun. 05, 2020
Applicant:

Siegfried Hofmann Gmbh, Lichtenfels, DE;

Inventors:

Daniel Feseker, Lichtenfels, DE;

Michael Deuerling, Lichtenfels, DE;

Michael Förste, Lichtenfels, DE;

Kai Fuhrmann, Lichtenfels, DE;

Johannes Günther, Lichtenfels, DE;

Benedikt Bechmann, Lichtenfels, DE;

Heinz Nolden, Meisenheim-Glan, DE;

Assignee:

SIEGFRIED HOFMANN GMBH, Lichtenfels, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 3/00 (2006.01); B23K 1/00 (2006.01); B23K 1/015 (2006.01); B23K 3/047 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
B23K 3/0478 (2013.01); B23K 1/015 (2013.01); B23K 2101/42 (2018.08);
Abstract

A device for soldering, in particular for reflow soldering, of at least one assembly, having a process chamber arrangement, comprises at least two process chambers for preparing a soldering method and/or for carrying out a soldering method and/or for post-processing a soldering method, wherein the at least two process chambers are arranged above one another, in particular in a stack-like manner.


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Feseker, Daniel. (2024). Device for soldering (U.S. Patent No. 12090577). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12090577

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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