Eggersdorf, Austria

Heinrich Trischler

This inventor holds 2 USPTO granted patents and 6 published patent applications and 4 EPO patents. Top assignee: At&s Austria Technologie & Systemtechnik Aktiengesellschaft. Active years: 2022-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Heinrich Trischler. Retrieved from https://idiyas.com/inventor/heinrich-trischler

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 100.0

 

Average Co-Inventor Count = 1.5

ph-index = 1


Company Filing History:


Years Active: 2022-2025

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2 patents (USPTO):Explore Patents

Title: Heinrich Trischler: Innovator in Microwave Applications

Introduction

Heinrich Trischler is a notable inventor based in Eggersdorf bei Graz, Austria. He has made significant contributions to the field of microwave applications, holding two patents that showcase his innovative spirit and technical expertise.

Latest Patents

Trischler's latest patents include a "Component carrier for microwave applications with stack pieces interconnected at an electrically conductive connection interface." This invention features a stack that comprises at least one electrically conductive layer structure and at least one electrically insulating layer structure, with a microwave structure embedded partially in the stack. The microwave structure is designed to excite a microwave propagation mode and includes at least two stack pieces interconnected at an electrically conductive connection interface.

Another significant patent is the "Method and apparatus for performing immersion tin process or copper plating process in the production of a component carrier." This method involves immersing part of a copper surface of the component carrier in a composition containing Sn(II) while passing a non-oxidizing gas through the immersion tin unit, with part of the gas being recycled. This patent also covers an apparatus for performing both immersion tin and copper plating processes in the production of a component carrier.

Career Highlights

Heinrich Trischler has worked with prominent companies such as AT&S Austria Technologie & Systemtechnik Aktiengesellschaft and his own venture, Trischler, Heinrich. His work in these organizations has allowed him to develop and refine his innovative ideas, contributing to advancements in technology.

Collaborations

Trischler has collaborated with talented individuals in his field, including Sebastian Sattler and Simon Pressler. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Heinrich Trischler's contributions to microwave applications and component carrier technologies highlight his role as a significant inventor in the field. His patents reflect a commitment to innovation and a deep understanding of the technical challenges in his area of expertise.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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