Bruckmuehl, Germany

Heinrich Kôrner

This inventor holds 1 USPTO granted patent. Top assignee: Infineon Technologies Ag. Active years: 2009.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Heinrich Kôrner. Retrieved from https://idiyas.com/inventor/heinrich-kôrner

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 9.0

ph-index = 1

Forward Citations = 46(Granted Patents)


Company Filing History:


Years Active: 2009

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1 patent (USPTO):Explore Patents

Title: Heinrich Kôrner and His Patent for Integrated Connection Arrangements.

Introduction

Heinrich Kôrner is an inventor associated with Bruckmuehl, Germany, and Infineon Technologies AG. His patent work includes an invention concerning electrical connection arrangements.

Latest Patents

Kôrner is credited with 1 patent, titled “Integrated Connection Arrangements.” The invention describes an outer conductive structure positioned at least partly within a cutout in an electrical insulation layer. An inner conductive structure lies at the bottom of the cutout and meets the outer structure in a contact zone. A separate contact area is located on the opposite side of the cutout, without overlapping the contact zone. The arrangement positions the cutout’s bottom to overlap at least half of the contact area, creating a step in the insulation layer outside the main current path between the contact area and the inner conductive structure.

Career Highlights

Kôrner’s listed professional association is with Infineon Technologies AG, a company working in the semiconductor industry. His patent reflects an engineering focus on the layout of conductive structures and insulation in electrical connections.

Collaborations

His listed coworkers include Andrea Mitchell and Markus Schwerd.

Conclusion

Heinrich Kôrner’s patent on integrated connection arrangements addresses the placement of conductive structures and insulation features in an electrical connection, and represents his documented contribution to invention at Infineon Technologies AG.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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