Infineon Technologies Ag

Heinrich Kôrner

Wolfgang Klein

Martin Seck

Thomas Goebel

Markus Schwerd

Johann Helneder

Andrea Mitchell

Martina Hommel

Stefan Drexl

A connection arrangement having an outer conductive structure arranged at least partly or completely in a cutout of an electrical insulation layer is provided. An inner conductive structure is arranged at the bottom of the cutout on one side of the insulation layer. The inner conductive structure adjoins the outer conductive structure in a contact zone. A contact area is arranged at the outer conductive structure on the other side of the cutout. The contact zone and the contact area do not overlap. The bottom of the cutout is arranged to overlaps at least half of the contact area, to provide a step in the insulation layer at the edge of the cutout outside a main current path between the contact area and the inner conductive structure.

Integrated connection arrangements

Growing community of inventors

Bruckmühl, Germany

Heinrich Kôrner